Mechanical properties of diamond-like carbon composite thin films prepared by pulsed laser deposition

被引:100
作者
Wei, Q [1 ]
Sharma, AK
Sankar, J
Narayan, J
机构
[1] NSF, Ctr Adv Mat & Smart Struct, Raleigh, NC USA
[2] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA
[3] N Carolina Agr & Tech State Univ, Dept Mech Engn, Greensboro, NC 27411 USA
关键词
thin films; hardness; Young's modulus;
D O I
10.1016/S1359-8368(99)00035-9
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have investigated the mechanical properties of diamond-like carbon (DLC) thin films that contain foreign atoms. The DLC films were prepared by pulsed laser deposition. A novel target design was adopted to incorporate foreign atoms into the DLC films during film deposition. Copper, titanium and silicon are chosen as the dopants. The chemical composition of the doped films was determined using Rutherford backscattering spectrometry, X-ray photoelectron spectroscopy and calibrated extrapolation. Experimental results of both visible and UV Raman are presented and discussed in terms of peak shape and position. The effect of dopants on the Raman spectrum is also analyzed, Optical microscopy of the pure DLC of a certain thickness showed severe buckling. A brief review of the theoretical background of adhesion is given and the possible mechanisms of adhesion that may work in DLC coatings are discussed. Qualitative scratch tests on the specimens show that pure DLC has quite pool. adhesion due to the large compressive stress, while the doped DLC films exhibit much improved adhesion. Wear tests show improved wear resistance in the doped DLC coatings. Nanoindentation results give an average hardness above 40 GPa and effective Young's modulus above 200 GPa for pure DLC.:The copper doped DLC films showed slightly decreased hardness and Young's modulus as compared to pure DLC films. Ti and Si can reduce the hardness and Young's modulus more than Cu. All these can be understood by analyzing the internal stress reduction as derived from Raman G-peak shift to lower wavenumbers. A preliminary model of the stress reduction mechanism is discussed. (C) 1999 Elsevier Science Ltd, All rights reserved.
引用
收藏
页码:675 / 684
页数:10
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