Micromachined high-aspect-ratio parylene spring and its application to low-frequency accelerometers

被引:67
作者
Suzuki, Yuji [1 ]
Tai, Yu-Chong
机构
[1] Univ Tokyo, Dept Mech Engn, Tokyo 1138656, Japan
[2] CALTECH, Dept Elect Engn, Pasadena, CA 91125 USA
基金
欧洲研究理事会;
关键词
capacitive accelerometer; high-aspect-ratio beam; low spring constant; parylene;
D O I
10.1109/JMEMS.2006.879706
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A new microfabrication technology for high-aspect-ratio parylene structure has been developed for soft spring applications. Free-standing parylene beams with widths of 10-40 mu m and aspect ratios of 10-20 have been successfully fabricated. Since parylene has a small Young's modulus, a high-aspect-ratio beam with a spring constant of the order of 1 X 10(-3) N/m has been realized. The large yield strain of parylene enables a test structure to have a large-amplitude oscillation of 600 pimp-p, without any failure of the high-aspect-ratio springs. An early prototype of in-plane capacitive accelerometer was also developed. It was found that its resonant frequency is as low as 37 Hz, and the noise spectral density is 64 mu g/(Hz)(0.5).
引用
收藏
页码:1364 / 1370
页数:7
相关论文
共 30 条
[1]   High aspect-ratio combined poly and single-crystal silicon (HARPSS) MEMS technology [J].
Ayazi, F ;
Najafi, K .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2000, 9 (03) :288-294
[2]   Characterization of a time multiplexed inductively coupled plasma etcher [J].
Ayón, AA ;
Braff, R ;
Lin, CC ;
Sawin, HH ;
Schmidt, MA .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1999, 146 (01) :339-349
[3]  
BERNSTEIN J, 1998, P SOL STAT SENS ACT, P55
[4]   An in-plane high-sensitivity, low-noise micro-g silicon accelerometer with CMOS readout circuitry [J].
Chae, J ;
Kulah, H ;
Najafi, K .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2004, 13 (04) :628-635
[5]   Polymer mems-based microgripper for single cell manipulation [J].
Chronis, N ;
Lee, LP .
MEMS 2004: 17TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2004, :17-20
[6]   STRESS IN THERMALLY ANNEALED PARYLENE FILMS [J].
DABRAL, S ;
VANETTEN, J ;
ZHANG, X ;
APBLETT, C ;
YANG, GR ;
FICALORA, P ;
MCDONALD, JF .
JOURNAL OF ELECTRONIC MATERIALS, 1992, 21 (10) :989-994
[7]   Parylene surface-micromachined membranes for sensor applications [J].
Fan, ZF ;
Engel, JM ;
Chen, J ;
Liu, C .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2004, 13 (03) :484-490
[8]   A model for the chemical vapor deposition of poly(para-xylylene) (parylene) thin films [J].
Fortin, JB ;
Lu, TM .
CHEMISTRY OF MATERIALS, 2002, 14 (05) :1945-1949
[9]   All-photoplastic, soft cantilever cassette probe for scanning force microscopy [J].
Genolet, G ;
Despont, M ;
Vettiger, P ;
Anselmetti, D ;
de Rooij, NF .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2000, 18 (02) :617-620
[10]   High-aspect-ratio micromachining via deep x-ray lithography [J].
Guckel, H .
PROCEEDINGS OF THE IEEE, 1998, 86 (08) :1586-1593