Silicon carbide as a new MEMS technology

被引:371
作者
Sarro, PM [1 ]
机构
[1] Delft Univ Technol, DIMES, Lab Elect Mat Devices & Components, NL-2600 GB Delft, Netherlands
关键词
MEMS; silicon carbide; micromachining; mechanical stress;
D O I
10.1016/S0924-4247(99)00335-0
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Silicon carbide (SiC) is a material with very attractive properties for microsystems applications. Its mechanical strength, high thermal conductivity, ability to operate at high temperatures and extreme chemical inertness in several liquid electrolytes, make SiC an attractive candidate for MEMS applications, both as structural material and as coating layer. The recently reported progress in material growth and processing techniques has strengthened the potential of this material for MEMS, especially for applications requiring operation at high temperature or in severe environments. Examples of SiC microsensors and microstructures are given and interesting development in both material characteristics and micromachining processes are discussed. (C) 2000 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:210 / 218
页数:9
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