Toward two-dimensional self-organization of nanostructures using wafer bonding and nanopatterned silicon surfaces

被引:10
作者
Buttard, D [1 ]
Eymery, J
Fournel, F
Gentile, P
Leroy, F
Magnea, N
Moriceau, H
Renaud, G
Rieutord, F
Rousseau, K
Rouvière, JL
机构
[1] CEA, Dept Rech Fondamentale Mat Condensee, F-38054 Grenoble, France
[2] Univ Grenoble 1, F-38041 Grenoble, France
[3] CEA, Dept Technol Silicium, LETI, F-38054 Grenoble, France
关键词
electron microscopy; silicon; wafer bonding; X-ray;
D O I
10.1109/JQE.2002.801003
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The structure of ultrathin silicon layers obtained by molecular hydrophobic bonding is investigated. The twist and tilt angles between the two crystals are accurately controlled. The buried Si\Si interface is observed by transmission electron microscopy and by grazing incidence X-ray techniques. For low twist angle values (psi < 5 degrees) plane view observations reveal well-defined dislocation networks. Cross-section observations give evidence that the dislocation networks are localized at the bonding interfacial plane with no threading dislocation. Grazing incidence small angle X-ray scattering measurements confirm the good quality of the bonding interface as well as the quality of the dislocation networks. Grazing incidence X-ray diffraction is also used and shows the long-range order of the periodic strain field in the silicon layer. It shows, especially, the interaction between the dislocations. X-ray reflectivity was employed and estimated that the inter-facial thickness (i.e., thickness of the bonding) lower than 1 ran decreases when the twist angle increases. The nanopatterned surface is then investigated by scanning tunneling microscopy and X-ray methods. To validate these substrates for long-range order self-organization, the growth of Si and Ge quantum dots is finally achieved.
引用
收藏
页码:995 / 1005
页数:11
相关论文
共 38 条
[1]   GROWTH, SHRINKAGE, AND STABILITY OF INTERFACIAL OXIDE LAYERS BETWEEN DIRECTLY BONDED SILICON-WAFERS [J].
AHN, KY ;
STENGL, R ;
TAN, TY ;
GOSELE, U ;
SMITH, P .
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 1990, 50 (01) :85-94
[2]   Dissociation of screw dislocations in (001) low-angle twist boundaries:: a source of the 30° partial dislocations in silicon [J].
Belov, AY ;
Scholz, R ;
Scheerschmidt, K .
PHILOSOPHICAL MAGAZINE LETTERS, 1999, 79 (08) :531-538
[3]  
BENAMARA M, 1996, THESIS U P SABATIER
[4]   How to control the self-organization of nanoparticles by bonded thin layers [J].
Bourret, A .
SURFACE SCIENCE, 1999, 432 (1-2) :37-53
[5]  
BRUEL M, Patent No. 9905711
[6]   Grazing incidence X-ray studies of twist-bonded Si/Si and Si/SiO2 interfaces [J].
Buttard, D ;
Eymery, J ;
Rieutord, F ;
Fournel, F ;
Lübbert, D ;
Baumbach, T ;
Moriceau, H .
PHYSICA B, 2000, 283 (1-3) :103-107
[7]  
BUTTARD D, UNPUB APPL PHYS LETT
[8]   X-ray reflectivity of ultrathin twist-bonded silicon wafers [J].
Eymery, J ;
Fournel, F ;
Rieutord, F ;
Buttard, D ;
Moriceau, H ;
Aspar, B .
APPLIED PHYSICS LETTERS, 1999, 75 (22) :3509-3511
[9]   Dislocation strain field in ultrathin bonded silicon wafers studied by grazing incidence x-ray diffraction -: art. no. 165337 [J].
Eymery, J ;
Buttard, D ;
Fournel, F ;
Moriceau, H ;
Baumbach, GT ;
Lübbert, D .
PHYSICAL REVIEW B, 2002, 65 (16) :1653371-1653376
[10]   X-ray reflectivity of silicon on insulator wafers [J].
Eymery, J ;
Rieutord, F ;
Fournel, F ;
Buttard, D ;
Moriceau, H .
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2001, 4 (1-3) :31-33