Copper bottom-up deposition by breakdown of PEG-Cl inhibition

被引：105

作者：

Hayase, M ^{[1
]}

Taketani, M

Aizawa, K

Hatsuzawa, T

Hayabusa, K

机构：

[1] Tokyo Inst Technol, Precis & Intelligence Lab, Kanagawa 2268503, Japan

[2] Ebara Res Co Ltd, Kanagawa 2518502, Japan

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 2002年 / 5卷 / 10期

关键词：

D O I：

10.1149/1.1507942

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Copper bottom-up deposition in 200 nm trenches by an acid-copper sulfate with only two additives [poly(ethylene glycol) (PEG) and Cl-] is achieved. The inhibiting effect of electrodeposition by PEG is strongly related to Cl- concentration. Secondary-ion mass spectroscopy measurements show that Cl- is consumed in the electroplating process. The explanation of bottom-up deposition realized in copper superfilling, in which the decrease of Cl- concentration causes rapid electrodeposition on trench bottoms, is verified experimentally. (C) 2002 The Electrochemical Society.

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页码：C98 / C101

页数：4

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