Mathematical modeling of polish-rate decay in chemical-mechanical polishing

被引：50

作者：

Borucki, L ^{[1
]}

机构：

[1] Motorola Inc, Mesa, AZ 85202 USA

来源：

JOURNAL OF ENGINEERING MATHEMATICS | 2002年 / 43卷 / 2-4期

关键词：

chemical-mechanical polishing; Hamilton-Jacobi equation; polymer wear; rate decay; surface statistics;

D O I：

10.1023/A:1020305108358

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A model is presented for polish-rate decay in chemical-mechanical polishing based on the Greenwood-Williamson theory of contact between a smooth surface (a wafer) and a rough surface (the polishing pad). The model assumes that polishing causes pad asperities to wear, with high asperities wearing faster than low asperities. Model predictions of the time dependence of polish-rate decay compare favorably with experiments.

引用

页码：105 / 114

页数：10

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