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Ten-channel optical transmitter module for sub-system interconnection operating at λ=1.3 μm up to 12.5 Gbit/s
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Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL's)
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Photonic packaging using laser/receiver arrays and flexible optical circuits
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING,
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