Electrochemical investigation of the Ni-Cu-Mo electrodeposition system

被引：27

作者：

BeltowskaLehman, E ^{[1
]}

Chassaing, E ^{[1
]}

机构：

[1] CNRS,CTR ETUD CHIM MET,F-94407 VITRY SUR SEINE,FRANCE

来源：

JOURNAL OF APPLIED ELECTROCHEMISTRY | 1997年 / 27卷 / 05期

关键词：

D O I：

10.1023/A:1018450729165

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The kinetics of Ni-Cu-Mo alloy deposition has been investigated by means of steady-state polarization measurements. Strong interactions between the three discharging metals occur: nickel induces molybdenum deposition but its discharge is markedly inhibited by molybdenum. Copper deposition has a depolarizing effect on Ni-Mo discharge. Hydrogen evolution is associated with molybdenum deposition. The electrocrystallization process is dominated by the Ni-Mo codischarge kinetics.

引用

页码：568 / 572

页数：5

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