共 37 条
[2]
BROWNLEE K, 2002, 8 INT S ADV PACK MAT, P249
[3]
Process development and adhesion behavior of electroless copper on liquid crystal polymer (LCP) for electronic packaging application
[J].
IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING,
2002, 25 (04)
:273-278
[4]
CULBERTSON EC, 1995, ELEC COMP C, P520, DOI 10.1109/ECTC.1995.515331
[5]
Liquid crystal polymer-based integrated passive development for RF applications
[J].
2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3,
2003,
:1155-1158
[6]
Devlin L., 2001, IMAPS NORD 38 ANN C
[7]
The processing of liquid crystalline polymer printed circuits
[J].
52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS,
2002,
:667-671
[8]
FREY J, 1975, MICROWAVE INTEGRATED, P20
[9]
GUILLON P, 1981, AEU, P102
[10]
Gupta K., 1996, MICROSTRIP LINES SLO, P108