Electrodeposition of Cu from acidic sulphate solutions in the presence of polyethylene glycol and chloride ions

被引：36

作者：

Bozzini, B. ^{[1
]}

D'Urzo, L. ^{[1
]}

Mele, C. ^{[1
]}

Romanello, V. ^{[1
]}

机构：

[1] Univ Lecce, Dipartimento Ingn Innovaz, I-73100 Lecce, Italy

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2006年 / 17卷 / 11期

关键词：

D O I：

10.1007/s10854-006-0044-x

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A surface-enhanced Raman scattering (SERS) spectroelectrochemical investigation has been carried out during Cu electrodeposition from an acidic sulphate solution in the presence of Polyethylene glycol (PEG) and chloride ions. PEG-related bands are clearly visible at the open circuit potential (OCP) and during the electroplating process, showing that the polymer is stably adsorbed on the Cu surface in a wide cathodic potential window. Our experimental range was limitated by the occurrence of fluorescence at potentials more cathodic then -200 mV versus Ag/AgCl, indicating the formation of fluorescent species by electrodic reaction. A tentative reactivity scheme for PEG is provided. The co-adsorption of chloride and sulphate species from copper (II) sulphate and sulphuric acid was highlighted as well.

引用

页码：915 / 923

页数：9

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