共 14 条
Optimized Structural Designs for Stretchable Silicon Integrated Circuits
被引:151
作者:

Kim, Dae-Hyeong
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h-index: 0
机构:
Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA
Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Liu, Zhuangjian
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h-index: 0
机构:
Inst High Performance Comp, Singapore 138632, Singapore Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Kim, Yun-Soung
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h-index: 0
机构:
Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA
Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Wu, Jian
论文数: 0 引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Song, Jizhou
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Miami, Dept Mech & Aerosp Engn, Coral Gables, FL 33146 USA Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Kim, Hoon-Sik
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA
Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Huang, Yonggang
论文数: 0 引用数: 0
h-index: 0
机构:
Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA
Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Hwang, Keh-chih
论文数: 0 引用数: 0
h-index: 0
机构:
Tsinghua Univ, Dept Engn Mech, Beijing 100084, Peoples R China Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Zhang, Yongwei
论文数: 0 引用数: 0
h-index: 0
机构:
Inst High Performance Comp, Singapore 138632, Singapore
Natl Univ Singapore, Dept Mat Sci & Engn, Singapore 119260, Singapore Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA

Rogers, John A.
论文数: 0 引用数: 0
h-index: 0
机构:
Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA
Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61801 USA
Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mech Sci & Engn, Urbana, IL 61801 USA
Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA
Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61801 USA Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA
机构:
[1] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mat Sci & Engn, Urbana, IL 61801 USA
[2] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Chem, Urbana, IL 61801 USA
[3] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Mech Sci & Engn, Urbana, IL 61801 USA
[4] Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA
[5] Univ Illinois, Beckman Inst Adv Sci & Technol, Dept Elect & Comp Engn, Urbana, IL 61801 USA
[6] Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA
[7] Northwestern Univ, Dept Mech Engn, Evanston, IL 60208 USA
[8] Inst High Performance Comp, Singapore 138632, Singapore
[9] Natl Univ Singapore, Dept Mat Sci & Engn, Singapore 119260, Singapore
[10] Univ Miami, Dept Mech & Aerosp Engn, Coral Gables, FL 33146 USA
[11] Tsinghua Univ, Dept Engn Mech, Beijing 100084, Peoples R China
来源:
基金:
美国国家科学基金会;
关键词:
flexible electronics;
nanomaterials;
nanomechanics;
semiconductors;
stretchable electronics;
ELECTRONIC-CIRCUITS;
INTERCONNECTS;
D O I:
10.1002/smll.200900853
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
Materials and design strategies for stretchable silicon integrated circuits that use non-coplanar mesh layouts and elastomeric substrates are presented. Detailed experimental and theoretical studies reveal many of the key underlying aspects of these systems. The results show, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of tip to approximate to 90%. Simple circuits, including complementary metal-oxide-semiconductor inverters and n-type metal-oxide-semiconductor differential amplifiers, validate these designs. The results suggest practical routes to high-performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies.
引用
收藏
页码:2841 / 2847
页数:7
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Univ Illinois, Dept Mech Sci & Engn, Urbana, IL 61801 USA
Univ Illinois, Frederick Seitz Mat Res Lab, Urbana, IL 61801 USA
Univ Illinois, Beckman Inst Adv Sci & Technol, Urbana, IL 61801 USA
Univ Illinois, Dept Elect & Comp Engn, Urbana, IL 61801 USA
Univ Illinois, Dept Chem, Urbana, IL 61801 USA Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
[10]
Stretchable interconnects for elastic electronic surfaces
[J].
Lacour, SP
;
Jones, J
;
Wagner, S
;
Li, T
;
Suo, ZG
.
PROCEEDINGS OF THE IEEE,
2005, 93 (08)
:1459-1467

Lacour, SP
论文数: 0 引用数: 0
h-index: 0
机构:
Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA

论文数: 引用数:
h-index:
机构:

Wagner, S
论文数: 0 引用数: 0
h-index: 0
机构: Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA

Li, T
论文数: 0 引用数: 0
h-index: 0
机构: Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA

Suo, ZG
论文数: 0 引用数: 0
h-index: 0
机构: Princeton Univ, Dept Elect Engn, Princeton, NJ 08544 USA