Microhardness and structural analysis of (TI,AI)N, (Ti,Cr)N, (Ti,Zr)N and (TI,V)N films

被引：74

作者：

Hasegawa, H ^{[1
]}

Kimura, A ^{[1
]}

Suzuki, T ^{[1
]}

机构：

[1] Keio Univ, Dept Mech Engn, Kohoku Ku, Yokohama, Kanagawa 2238522, Japan

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A | 2000年 / 18卷 / 03期

关键词：

D O I：

10.1116/1.582296

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Ti-based binary nitride and ternary nitride films were deposited on cemented carbide by the arc ion plating method and investigated on microhardness, lattice parameter and morphology. Micro-Vickers hardness of TiN, CrN, and ZrN binary films was 2000, 1400, and 1500 HV, respectively. On the other hand, ternary nitrides such as (Ti,AI)N, (TiCr)N, (Ti,Zr)N, and (Ti,V)N with identical atomic ratio against Ti generally had higher hardness of 3100, 3000, 3000, and 2400 HV, respectively. The lattice parameters of both (Ti,AI)N and (Ti,Cr)N were smaller with 4.18 and 4.19 Angstrom. Futhermore, the surface roughness of TiN, CrN, ZrN, (TiAl)N, and (TiZr)N films was all smooth with small number of droplets, while that of (Ti,Cr)N and (Ti,V)N films became rough with large number of droplets. (C) 2000 American Vacuum Society. [S0734-2101(00)00403-6].

引用

页码：1038 / 1040

页数：3

共 10 条

[1]

IKEDA T, 1991, THIN SOLID FILMS, V195, P99, DOI 10.1016/0040-6090(91)90262-V

[2] Effects of Al content on hardness, lattice parameter and microstructure of Ti1-xAlxN films [J].

Kimura, A ;

Hasegawa, H ;

Yamada, K ;

Suzuki, T .

SURFACE & COATINGS TECHNOLOGY, 1999, 120 :438-441

[3] THE STRUCTURE AND COMPOSITION OF TI-ZR-N, TI-AL-ZR-N AND TI-AL-V-N COATINGS [J].

KNOTEK, O ;

BOHMER, M ;

LEYENDECKER, T ;

JUNGBLUT, F .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1988, 106 :481-488

[4] CORROSION BEHAVIOR IN ACID-SOLUTION OF (TI, CR)N-X FILMS DEPOSITED ON GLASS [J].

MASSIANI, Y ;

GRAVIER, P ;

FEDRIZZI, L ;

MARCHETTI, F .

THIN SOLID FILMS, 1995, 261 (1-2) :202-208

[5]

MUNZ WD, 1986, J VAC SCI TECHNOL A, V4, P2717, DOI 10.1116/1.573713

[6] DEPOSITION AND CHARACTERIZATION OF TERNARY NITRIDES [J].

RANDHAWA, H ;

JOHNSON, PC ;

CUNNINGHAM, R .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1988, 6 (03) :2136-2139

[7] GROWTH AND CHARACTERIZATION OF CATHODIC ARE EVAPORATED CRN, (TIAL)N AND (TIZR)N FILMS [J].

SANT, SB ;

GILL, KS .

SURFACE & COATINGS TECHNOLOGY, 1994, 68 :152-156

[8] Microstructures and grain boundaries of(Ti,Al)N films [J].

Suzuki, T ;

Huang, D ;

Ikuhara, Y .

SURFACE & COATINGS TECHNOLOGY, 1998, 107 (01) :41-47

[9] (TICR)N COATINGS DEPOSITED BY CATHODIC VACUUM ARE EVAPORATION [J].

VETTER, J ;

SCHOLL, HJ ;

KNOTEK, O .

SURFACE & COATINGS TECHNOLOGY, 1995, 74-5 (1-3) :286-291

[10] Observations on the structure, hardness and adhesion properties of a selection of multicomponent refractory element nitride coatings [J].

Ward, LP ;

Strafford, KN ;

Subramanian, C ;

Wilks, TP .

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1996, 56 (1-4) :375-384

← 1 →