Thermal behavior of silver nanoparticles for low-temperature interconnect applications

被引：330

作者：

Moon, KS ^{[1
]}

Dong, H

Maric, R

Pothukuchi, S

Hunt, A

Li, Y

Wong, CP

机构：

[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA

[2] NGimat Corp, Atlanta, GA 30341 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2005年 / 34卷 / 02期

基金：

美国国家科学基金会;

关键词：

silver nanoparticles; thermal behavior; sintering; melting point depression; low-temperature interconnect;

D O I：

10.1007/s11664-005-0229-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Low-temperature sintering behavior of Ag nanoparticles was investigated. The nano Ag particles used (similar to20 nm) exhibited obvious sintering behavior at significantly lower temperatures (similar to150degreesC) than the T-m (960degreesC) of silver. Coalescence of the nano Ag particles was observed by sintering the particles at 150degreesC, 200degreesC, and 250degreesC. The thermal profile of the nanoparticles was examined by a differential scanning calorimeter (DSC) and a thermogravimetric analyzer (TGA). Shrinkage of the Ag-nanoparticle compacts during the sintering process was observed by thermomechanical analysis (TAU). Sintering of the nanoparticle pellet led to a significant increase in density and electrical conductivity. The size of the sintered particles and the crystallite size of the particles increased with increasing sintering temperature.

引用

页码：168 / 175

页数：8

共 9 条

[1] SMALL PARTICLE MELTING OF PURE METALS [J].

ALLEN, GL ;

BAYLES, RA ;

GILE, WW ;

JESSER, WA .

THIN SOLID FILMS, 1986, 144 (02) :297-308

[2] EMBEDDED-ATOM METHOD - DERIVATION AND APPLICATION TO IMPURITIES, SURFACES, AND OTHER DEFECTS IN METALS [J].

DAW, MS ;

BASKES, MI .

PHYSICAL REVIEW B, 1984, 29 (12) :6443-6453

[3] Molecular dynamics study on the coalescence of Cu nanoparticles and their deposition on the Cu substrate [J].

Dong, H ;

Moon, KS ;

Wong, CP .

JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (11) :1326-1330

[4] COMBUSTION CHEMICAL-VAPOR-DEPOSITION - A NOVEL THIN-FILM DEPOSITION TECHNIQUE [J].

HUNT, AT ;

CARTER, WB ;

COCHRAN, JK .

APPLIED PHYSICS LETTERS, 1993, 63 (02) :266-268

[5] ELECTRICALLY CONDUCTIVE ADHESIVES - A PROSPECTIVE ALTERNATIVE FOR SMD SOLDERING [J].

JAGT, JC ;

BERIS, PJM ;

LIJTEN, GFCM .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02) :292-298

[6]

Lu D., 1999, IEEE Transactions on Components, V22, P223

[7] Improvement of adhesion and electrical properties of reworkable thermoplastic conductive adhesives [J].

Moon, K ;

Rockett, C ;

Kretz, C ;

Burgoyne, WF ;

Wong, CP .

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2003, 17 (13) :1785-1799

[8]

Oda M, 2002, MATER RES SOC SYMP P, V704, P3

[9]

WONG CP, 2003, GEORGIA TECH CORP IN

← 1 →