A technique forinterconnecting millimeter wave integrated circuits using BCB and bump bonds

被引：12

作者：

Carrillo-Ramirez, R ^{[1
]}

Jackson, RW ^{[1
]}

机构：

[1] Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2003年 / 13卷 / 06期

关键词：

BCB; MCM; millimeter wave; MMIC; packaging; Si micromachining; SOP; stud bumps;

D O I：

10.1109/LMWC.2003.811677

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A low cost interconnection scheme for millimeter wave modules is presented. This technique allows the integration of hybrid components using an inexpensive micromachined silicon motherboard and benzocyclobutene (BCB) films. The excellent planarity of BCB allows vias to be formed using bumps fabricated prior to BCB application. This approach eliminates the need for laser drilling, plasma etching, and plated holes.. Several representative GaAs pHEMT's Were packaged using this technique. Measurements show minimal. performance degradation from 1 GHz to 48 GHz.

引用

页码：196 / 198

页数：3