Compact distributed RLC interconnect models - Part II: Coupled line transient expressions and peak crosstalk in multilevel networks

被引：101

作者：

Davis, JA ^{[1
]}

Meindl, JD ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 2000年 / 47卷 / 11期

关键词：

crosstalk; inductance; interconnections; time domain analysis; transmission line theory;

D O I：

10.1109/16.877169

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Novel compact expressions that describe the transient response of high-speed resistance, inductance, and capacitance (rlc) coupled interconnects are rigorously derived, These new distributed rlc models reveal that peak crosstalk voltage is over 60% larger for 3 GHz high-speed interconnects than predicted by current distributed re models. Simplified forms of the compact models enable physical insight and accurate estimation of peak crosstalk voltage between two and three distributed rlc interconnects.

引用

页码：2078 / 2087

页数：10

共 7 条

[1]

Bakoglu H., 1990, CIRCUITS INTERCONNEC

[2] MULTILEVEL METAL CAPACITANCE MODELS FOR CAD DESIGN SYNTHESIS SYSTEMS [J].

CHERN, JH ;

HUANG, J ;

ARLEDGE, L ;

LI, PC ;

PING, Y .

IEEE ELECTRON DEVICE LETTERS, 1992, 13 (01) :32-34

[3] Compact distributed RLC interconnect models - Part I: Single line transient, time delay, and overshoot expressions [J].

Davis, JA ;

Meindl, JD .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 2000, 47 (11) :2068-2077

[4] On-chip interconnects - Giga hertz and beyond [J].

Lee, K .

PROCEEDINGS OF THE IEEE 1998 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 1998, :15-17

[5]

PAUL CR, 1994, ANAL MULTI CONDUCTOR

[6] CLOSED-FORM EXPRESSIONS FOR INTERCONNECTION DELAY, COUPLING, AND CROSSTALK IN VLSIS [J].

SAKURAI, T .

IEEE TRANSACTIONS ON ELECTRON DEVICES, 1993, 40 (01) :118-124

[7]

*SEM IND ASS, 1997, NAT TECHN ROADM SEM

← 1 →