Power estimation and thermal budgeting methodology for FPGAs

被引:5
作者
Lui, HY [1 ]
Lee, CH [1 ]
Patel, RH [1 ]
机构
[1] Altera Corp, San Jose, CA 95134 USA
来源
PROCEEDINGS OF THE IEEE 2004 CUSTOM INTEGRATED CIRCUITS CONFERENCE | 2004年
关键词
D O I
10.1109/CICC.2004.1358928
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The method used for power estimation and thermal budgeting on an FPGA product line, which will be fabricated using the 90nm technology is described in this paper. It addresses the reasons why state-of-the-art processes create power concerns on FPGAs, and describes methodologies that provide more relevant power and junction temperature estimations. Finally it suggests what can be done to improve the power budget and to balance the trade-offs between power and performance.
引用
收藏
页码:711 / 714
页数:4
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