Curving Nanostructures Using Extrinsic Stress

被引:64
作者
Cho, Jeong-Hyun [2 ]
James, Teena [2 ]
Gracias, David H. [1 ,2 ]
机构
[1] Johns Hopkins Univ, Dept Chem, Baltimore, MD 21218 USA
[2] Johns Hopkins Univ, Dept Chem & Biomol Engn, Baltimore, MD 21218 USA
基金
美国国家科学基金会;
关键词
THIN-FILMS; NANOTUBES; FABRICATION; METAL;
D O I
10.1002/adma.200904410
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
We demonstrate the concept of inducing stresses in thin films post-deposition (extrinsic stress) to curve nanostructures on demand. The remarkably high extrinsic stress, induced by triggering grain coalescence in Sn thin films, was used to self-assemble 3D nanostructures with radii of curvature as small as 20 nm. The fabrication methodology required only simple processing steps and the self-assembly process was highly parallel. Curved nanostructures with any desired pattern and both homogeneous (rings, tubes) and variable radii of curvature (spirals, talons) could be constructed.
引用
收藏
页码:2320 / 2324
页数:5
相关论文
共 24 条
[1]   Microassembly based on hands free origami with bidirectional curvature [J].
Bassik, Noy ;
Stern, George M. ;
Gracias, David H. .
APPLIED PHYSICS LETTERS, 2009, 95 (09)
[2]   Surface stress in the self-assembly of alkanethiols on gold [J].
Berger, R ;
Delamarche, E ;
Lang, HP ;
Gerber, C ;
Gimzewski, JK ;
Meyer, E ;
Guntherodt, HJ .
SCIENCE, 1997, 276 (5321) :2021-2024
[3]   Self-Assembly of Lithographically Patterned Nanoparticles [J].
Cho, Jeong-Hyun ;
Gracias, David H. .
NANO LETTERS, 2009, 9 (12) :4049-4052
[4]   Out-of-plane high-Q inductors on low-resistance silicon [J].
Chua, CL ;
Fork, DK ;
Van Schuylenbergh, K ;
Lu, JP .
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2003, 12 (06) :989-995
[5]   Translating biomolecular recognition into nanomechanics [J].
Fritz, J ;
Baller, MK ;
Lang, HP ;
Rothuizen, H ;
Vettiger, P ;
Meyer, E ;
Güntherodt, HJ ;
Gerber, C ;
Gimzewski, JK .
SCIENCE, 2000, 288 (5464) :316-318
[6]   Sn film deposition on silica glass substrates [J].
Hishita, S ;
Stryhal, Z ;
Sakaguchi, I ;
Ohashi, N ;
Saito, N ;
Haneda, H .
THIN SOLID FILMS, 2004, 464 :146-149
[7]   STRESSES IN THIN-FILMS - RELEVANCE OF GRAIN-BOUNDARIES AND IMPURITIES [J].
HOFFMAN, RW .
THIN SOLID FILMS, 1976, 34 (02) :185-190
[8]   Nanomechanical architecture of strained bilayer thin films: From design principles to experimental fabrication [J].
Huang, MH ;
Boone, C ;
Roberts, M ;
Savage, DE ;
Lagally, MG ;
Shaji, N ;
Qin, H ;
Blick, R ;
Nairn, JA ;
Liu, F .
ADVANCED MATERIALS, 2005, 17 (23) :2860-+
[9]   THE INTRINSIC STRESS OF POLYCRYSTALLINE AND EPITAXIAL THIN METAL-FILMS [J].
KOCH, R .
JOURNAL OF PHYSICS-CONDENSED MATTER, 1994, 6 (45) :9519-9550
[10]  
Lide D.R., 2009, Handbook of Chemistry and Physics, V89th