Mechanical polishing technique for carbon nanotube interconnects in ULSIs

被引：16

作者：

Horibe, M

Nihei, M

Kondo, D

Kawabata, A

Awano, Y

机构：

[1] Fujitsu Ltd, Atsugi, Kanagawa 2430197, Japan

[2] Fujitsu Labs Ltd, Yokoyama Fellow Grp, Atsugi, Kanagawa 2430197, Japan

[3] Fujitsu Labs Ltd, Nanotechnol Res Ctr, Atsugi, Kanagawa 2430197, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS | 2004年 / 43卷 / 9A期

关键词：

future ultralarge scale integrated (ULSI) circuits; interconnects; multiwalled carbon nanotube (MWNT); mechanical polishing technique; diamond particles;

D O I：

10.1143/JJAP.43.6499

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We examined a mechanical polishing technique for multiwalled carbon nanotube (MWNT) vias. This polishing technique involved the use of diamond particles fixing MWNT protrusions of the samples. The 1-mum-high outthrust MWNTs were polished, and then flat sample surfaces were obtained by controlling polishing pressure and polishing time. A cross-sectional image of a cut MWNT was obtained by high-resolution scanning electron microscopy. Mechanically polished MWNT interconnects with a high current density and a low resistance were developed.

引用

页码：6499 / 6502

页数：4

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