Imaging of Si nano-patterns embedded in SiO2 using scanning electron microscopy

被引:10
作者
Nagase, M [1 ]
Kurihara, K [1 ]
机构
[1] Nippon Telegraph & Tel Corp, Basic Res Labs, Atsugi, Kanagawa 2430198, Japan
关键词
D O I
10.1016/S0167-9317(00)00310-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Detailed shapes of embedded Si nanostructures were clearly observed through a SiO2 layer using scanning electron microscopy (SEM). We Pound a new imaging mechanism by which secondary electron (SE) yield from the oxide surface is greater where an embedded Si structure exists. In the range of acceleration voltages from 5 to 200 kV, we found that 30 kV provides high contrast and high resolution. Controlling the surface contrast by depositing a contaminated film using electron beam irradiation yields a clear, high-resolution SEM image of sub-10-nm Si structures embedded in a 60-nm-thick oxide. The combination of a non-destructive observation method based on SEM with a method based on AFM, which was demonstrated previously, provides detailed information on the three-dimensional shape of embedded Si nanodevices.
引用
收藏
页码:257 / 260
页数:4
相关论文
共 6 条
[1]   A STUDY OF BSE SIGNALS OF DOUBLE-LAYERS ON SUBSTRATES AT VARIOUS DETECTOR TAKE-OFF ANGLES [J].
HEJNA, J .
SCANNING, 1992, 14 (05) :256-261
[2]   Analysis of high-acceleration-voltage scanning electron microscope images [J].
Moniwa, A ;
Terasawa, T .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (12B) :7032-7037
[3]   Si nanostructures formed by pattern-dependent oxidation [J].
Nagase, M ;
Fujiwara, A ;
Yamazaki, K ;
Takahashi, Y ;
Murase, K ;
Kurihara, K .
MICROELECTRONIC ENGINEERING, 1998, 42 :527-530
[4]   Fabrication method for IC-oriented Si twin-island single-electron transistors [J].
Ono, Y ;
Takahashi, Y ;
Yamazaki, K ;
Nagase, M ;
Namatsu, H ;
Kurihara, K ;
Murase, K .
INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, :123-126
[5]  
SEILER H, 1976, SCANNING ELECTRON MI, V1, P9
[6]  
TAKAHASHI Y, 1994, INTERNATIONAL ELECTRON DEVICES MEETING 1994 - IEDM TECHNICAL DIGEST, P938, DOI 10.1109/IEDM.1994.383257