Multiple film cracking in film/substrate systems with residual stresses and unidirectional loading

被引：76

作者：

Hsueh, CH

Yanaka, M

机构：

[1] Oak Ridge Natl Lab, Div Met & Ceram, Oak Ridge, TN 37831 USA

[2] Toppan Tech Res Inst, Sugito, Saitama 3458508, Japan

来源：

JOURNAL OF MATERIALS SCIENCE | 2003年 / 38卷 / 08期

关键词：

D O I：

10.1023/A:1023200415364

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Multiple film cracking in film/substrate systems is analyzed in the present study. Specifically, the experimental measurements of multiple cracking of SiOx films of various thicknesses on polyethylene terephthalate substrates are analyzed. The system is subjected to both residual stresses and unidirectional tensile loading. Considering a three-dimensional geometry, an analytical model is developed to derive the stress distribution in the system, and the film-cracking problem is analyzed using both the strength and the energy criteria. Compared to the strength criterion, the energy criterion shows better agreement with the measurements of the crack density versus applied strain relation. (C) 2003 Kluwer Academic Publishers.

引用

页码：1809 / 1817

页数：9

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