Crack formation and substrate effects on electrical resistivity of inkjet-printed Ag lines

被引：43

作者：

Lee, Dong Jun ^{[1
]}

Oh, Je Hoon ^{[1
]}

Bae, Han Seung ^{[1
]}

机构：

[1] Hanyang Univ, Dept Mech Engn, Ansan 426791, Gyeonggi Do, South Korea

来源：

MATERIALS LETTERS | 2010年 / 64卷 / 09期

关键词：

Electrical resistivity; Inkjet printing; Nanoparticle ink; Cracks; Residual thermal stresses;

D O I：

10.1016/j.matlet.2010.02.014

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We investigated electrical properties of inkjet-printed Ag lines by varying the substrate, dimension of lines and sintering temperature. The effect of cracks developed in the lines during drying and sintering was also examined. The results show clear evidence of a strong crack and substrate effect on electrical properties of printed Ag lines. The crack formation is clearly dependent on the dimension of lines. Crack network occurs and becomes more pronounced for wider and thicker lines. Even without the crack formation, the resistance and resistivity of lines on glass are higher than those on polyimide due to residual thermal stresses. (C) 2010 Elsevier B.V. All rights reserved.

引用

页码：1069 / 1072

页数：4

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