Wafer-bonded surface plasmon waveguides

被引：13

作者：

Berini, Pierre ^{[1
]}

Mattiussi, Greg

Lahoud, Nancy

Charbonneau, Robert

机构：

[1] Univ Ottawa, Sch Informat Technol & Engn, Ottawa, ON K1N 6N5, Canada

[2] Spectalis Corp, Ottawa, ON K1S 4E6, Canada

[3] Epocal Corp, Ottawa, ON K1G 6C6, Canada

[4] Spectalis Corp, Ottawa, ON K1S 4E6, Canada

[5] Def Res & Dev, Toronto, ON M3M 3B9, Canada

来源：

APPLIED PHYSICS LETTERS | 2007年 / 90卷 / 06期

关键词：

D O I：

10.1063/1.2468660

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Direct wafer bonding and thinning were explored as an approach for constructing long-range surface plasmon waveguides. The structures consist of a thin metal stripe deposited into a shallow trench etched into one of the claddings, to which another cladding of the same material is directly bonded. The approach was developed first using Pyrex wafers in order to assess feasibility and then using lithium niobate wafers. Optical and electro-optical measurements validate the approach.

引用

页数：3

共 32 条

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