Single-layer thin HfO2 gate dielectric with n+-polysilicon gate
被引:70
作者:
Kang, LG
论文数: 0引用数: 0
h-index: 0
机构:
Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USAUniv Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
Kang, LG
[1
]
Jeon, Y
论文数: 0引用数: 0
h-index: 0
机构:
Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USAUniv Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
Jeon, Y
[1
]
Onishi, K
论文数: 0引用数: 0
h-index: 0
机构:
Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USAUniv Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
Onishi, K
[1
]
Lee, BH
论文数: 0引用数: 0
h-index: 0
机构:
Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USAUniv Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
Lee, BH
[1
]
Qi, WJ
论文数: 0引用数: 0
h-index: 0
机构:
Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USAUniv Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
Qi, WJ
[1
]
Nieh, R
论文数: 0引用数: 0
h-index: 0
机构:
Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USAUniv Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
Nieh, R
[1
]
Gopalan, S
论文数: 0引用数: 0
h-index: 0
机构:
Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USAUniv Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
Gopalan, S
[1
]
Lee, JC
论文数: 0引用数: 0
h-index: 0
机构:
Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USAUniv Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
Lee, JC
[1
]
机构:
[1] Univ Texas, Microelect Res Ctr, Dept Elect & Comp Engn, Austin, TX 78758 USA
来源:
2000 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS
|
2000年
关键词:
D O I:
10.1109/VLSIT.2000.852762
中图分类号:
TP3 [计算技术、计算机技术];
学科分类号:
0812 ;
摘要:
MOSCAPs and MOSFETs of a single-layer thin HfO2 gate dielectric with n+ polysilicon gate were fabricated and characterized. Polysilicon process was optimized such that leakage current and equivalent oxide thickness of HfO2 remained low. Excellent C-V properties (e.g. low Dit and frequency dispersion) and reliability characteristics were obtained. Reasonable MOSFET quality was also demonstrated.