Automatic control in microelectronics manufacturing: Practices, challenges, and possibilities

被引:169
作者
Edgar, TF [1 ]
Butler, SW
Campbell, WJ
Pfeiffer, C
Bode, C
Hwang, SB
Balakrishnan, KS
Hahn, J
机构
[1] Univ Texas, Dept Chem Engn, Austin, TX 78712 USA
[2] Texas Instruments Inc, Dallas, TX USA
[3] Adv Micro Devices Inc, Austin, TX USA
[4] Motorola Inc, Austin, TX USA
[5] Hyundai, Ichon, South Korea
关键词
end point control; factory automation; microelectronics manufacturing; predictive control; process control; quality control; sensors; temperature control;
D O I
10.1016/S0005-1098(00)00084-4
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Advances in modeling and control will be required to meet future technical challenges in microelectronics manufacturing. The implementation of closed-loop control on key unit operations has been limited due to a dearth of suitable in situ measurements, variations in process equipment and wafer properties, limited process understanding, non-automated operational practices, and lack of trained personnel. This paper reviews the state-of-the-art for process control in semiconductor processing, and covers the key unit operations of lithography, plasma etching, thin film deposition, rapid thermal processing, and chemical-mechanical planarization. The relationship of process (equipment) models to control strategies is elaborated because recently there has been a considerable level of activity in model development in industry and academia. A proposed control framework for integrating factory control and equipment scheduling, supervisory control, feedback control, statistical process control, and fault detection/diagnosis in microelectronics manufacturing is presented and discussed. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:1567 / 1603
页数:37
相关论文
共 122 条
[21]   Modeling of plasma etch systems using ordinary least squares, recurrent neural network, and projection to latent structure models [J].
Bushman, S ;
Edgar, TF ;
Trachtenberg, I .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (04) :1379-1389
[22]   INTELLIGENT MODEL-BASED CONTROL-SYSTEM EMPLOYING IN-SITU ELLIPSOMETRY [J].
BUTLER, SW ;
STEFANI, J ;
SULLIVAN, M ;
MAUNG, S ;
BARNA, G ;
HENCK, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1994, 12 (04) :1984-1991
[23]   PROCESS-CONTROL IN SEMICONDUCTOR MANUFACTURING [J].
BUTLER, SW .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1995, 13 (04) :1917-1923
[24]   SUPERVISORY RUN-TO-RUN CONTROL OF POLYSILICON GATE ETCH USING IN-SITU ELLIPSOMETRY [J].
BUTLER, SW ;
STEFANI, JA .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1994, 7 (02) :193-201
[25]  
BUTLER SW, 1995, WORKSH IND APPL PLAS, VA
[26]   PROGRAMMED RATE PROCESSING TO INCREASE THROUGHPUT IN LPCVD [J].
CALE, TS ;
JAIN, MK ;
RAUPP, GB .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (05) :1526-1533
[27]   Dynamic neural control for a plasma etch process [J].
Card, JP ;
Sniderman, DL ;
Klimasauskas, C .
IEEE TRANSACTIONS ON NEURAL NETWORKS, 1997, 8 (04) :883-901
[28]  
Chatterjee S., 1993, P RTP C SCOTTSD, P386
[29]   The measured performance of personal computer operating systems [J].
Chen, JB ;
Endo, Y ;
Chan, K ;
Mazieres, D ;
Dias, A ;
Seltzer, M ;
Smith, MD .
ACM TRANSACTIONS ON COMPUTER SYSTEMS, 1996, 14 (01) :3-40
[30]   OVERVIEW OF GATE LINEWIDTH CONTROL IN THE MANUFACTURE OF CMOS LOGIC CHIPS [J].
CHESEBRO, DG ;
ADKISSON, JW ;
CLARK, LR ;
ESLINGER, SN ;
FAUCHER, MA ;
HOLMES, SJ ;
MALLETTE, RP ;
NOWAK, EJ ;
SENGLE, EW ;
VOLDMAN, SH ;
WEEKS, TW .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1995, 39 (1-2) :189-200