Automatic control in microelectronics manufacturing: Practices, challenges, and possibilities

被引:169
作者
Edgar, TF [1 ]
Butler, SW
Campbell, WJ
Pfeiffer, C
Bode, C
Hwang, SB
Balakrishnan, KS
Hahn, J
机构
[1] Univ Texas, Dept Chem Engn, Austin, TX 78712 USA
[2] Texas Instruments Inc, Dallas, TX USA
[3] Adv Micro Devices Inc, Austin, TX USA
[4] Motorola Inc, Austin, TX USA
[5] Hyundai, Ichon, South Korea
关键词
end point control; factory automation; microelectronics manufacturing; predictive control; process control; quality control; sensors; temperature control;
D O I
10.1016/S0005-1098(00)00084-4
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
Advances in modeling and control will be required to meet future technical challenges in microelectronics manufacturing. The implementation of closed-loop control on key unit operations has been limited due to a dearth of suitable in situ measurements, variations in process equipment and wafer properties, limited process understanding, non-automated operational practices, and lack of trained personnel. This paper reviews the state-of-the-art for process control in semiconductor processing, and covers the key unit operations of lithography, plasma etching, thin film deposition, rapid thermal processing, and chemical-mechanical planarization. The relationship of process (equipment) models to control strategies is elaborated because recently there has been a considerable level of activity in model development in industry and academia. A proposed control framework for integrating factory control and equipment scheduling, supervisory control, feedback control, statistical process control, and fault detection/diagnosis in microelectronics manufacturing is presented and discussed. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:1567 / 1603
页数:37
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