Evolution of cooling technology for electrical, electronic, and microelectronic equipment

被引：43

作者：

Bergles, AE

机构：

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2003年 / 26卷 / 01期

关键词：

cooling technology; heat transfer; microminiaturization;

D O I：

10.1109/TCAPT.2003.809664

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Selected aspects of cooling technology for electrical apparatus and electronic devices are considered for the past 80 years. The emphasis is on the past 50 years. The technology has evolved to meet the challenges of microminiaturization, and heat transfer considerations are now an integral part of the design procedure for microelectronic systems.

引用

页码：6 / 15

页数：10

共 64 条

[1]

AMON CH, 2002, P 8 INT C THERM THER

[2]

[Anonymous], ADV THERMAL MODELING

[3]

[Anonymous], 1980, Cooling Techniques For Electronic Equipment

[4]

[Anonymous], 1983, THERMAL ANAL CONTROL

[5] BIBLIOGRAPHY OF HEAT-TRANSFER IN ELECTRONIC EQUIPMENT [J].

ANTONETTI, VW ;

SIMONS, RE .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1985, 8 (02) :289-295

[6] TEMPERATURE DIFFERENCE IN NUCLEATE BOILING [J].

ARMSTRONG, RJ .

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1966, 9 (10) :1148-+

[7] FREE CONVECTION COOLING OF ELECTRONIC SYSTEMS [J].

AUNG, W ;

KESSLER, TJ ;

BEITIN, KI .

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (02) :75-86

[8]

AUNG W, 1991, COOLING TECHNIQUES C

[9] LIQUID COOLING OF MICROELECTRONIC DEVICES BY FREE AND FORCED CONVECTION [J].

BAKER, E .

MICROELECTRONICS AND RELIABILITY, 1972, 11 (02) :213-&

[10]

BARCOHEN A, 1983, MECH ENG, V105, P53

← 1 2 3 4 5 6 7 →