Pd nanoparticles as a new activator for electroless copper deposition

被引：27

作者：

Lee, CL ^{[1
]}

Wan, CC ^{[1
]}

Wang, YY ^{[1
]}

机构：

[1] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 30043, Taiwan

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2003年 / 150卷 / 03期

关键词：

D O I：

10.1149/1.1542899

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Pd nanoparticles were synthesized and finely controlled by the proper choice of surfactants with different carbon chain lengths. The feasibility of using this newly synthesized Pd nanoparticles as an activator for electroless copper deposition was examined. In this study, copper was successfully deposited on a wafer with a 0.25 mum microtrench. In addition, the effects of the surrounding functional group and the particle size on the kinetics of electroless copper deposition were studied by electrochemical quartz crystal microgravimetry. The performance of Pd nanoparticles was also compared with the traditional Pd/Sn colloid-type activator. (C) 2003 The Electrochemical Society.

引用

页码：C125 / C130

页数：6

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