Dynamic scaling of the surface roughness of Cu deposited using a chemical bath

被引：27

作者：

Hasan, NM

Mallett, JJ

dos Santos, SG

Pasa, AA

Schwarzacher, W

机构：

[1] Univ Bristol, HH Wills Phys Lab, Bristol BS8 1TL, Avon, England

[2] LSIEPUSP, BR-05508900 Sao Paulo, Brazil

[3] Univ Fed Santa Catarina, Dept Fis, Florianopolis, SC, Brazil

来源：

PHYSICAL REVIEW B | 2003年 / 67卷 / 08期

关键词：

D O I：

10.1103/PhysRevB.67.081401

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In electroless deposition, a chemical reducing agent is used to deposit a metal film from a solution of its ions. Electroless Cu films deposited with HCHO as the reducing agent exhibit anomalous scaling, with the root-mean-square interface width w varying as t(beta loc) at short length scales. Changing the HCHO concentration changes the growth rate, but not the scaling exponents other than beta(loc). The nonchanging exponents were measured as H=0.74+/-0.03 and beta=0.28+/-0.03, where H is the Hurst exponent, and w varies as t(beta+beta loc) at long length scales. Our results reveal similarities with the dynamic scaling of conventional electrodeposited films.

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页数：4

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共 20 条

[1] THEORY OF POWDERED CRYSTAL-FORMATION IN ELECTRO-CRYSTALLIZATION - OCCURRENCE OF MORPHOLOGICAL INSTABILITY AT THE ELECTRODE SURFACE [J].

AOGAKI, R ;

KITAZAWA, K ;

KOSE, Y ;

FUEKI, K .

ELECTROCHIMICA ACTA, 1980, 25 (07) :965-972

[2] Super-rough dynamics on tumor growth [J].

Bru, A ;

Pastor, JM ;

Fernaud, I ;

Bru, I ;

Melle, S ;

Berenguer, C .

PHYSICAL REVIEW LETTERS, 1998, 81 (18) :4008-4011

[3] Selective and blanket electroless copper deposition for ultralarge scale integration [J].

Dubin, VM ;

ShachamDiamand, Y ;

Zhao, B ;

Vasudev, PK ;

Ting, CH .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (03) :898-908

[4] SCALING OF THE ACTIVE ZONE IN THE EDEN PROCESS ON PERCOLATION NETWORKS AND THE BALLISTIC DEPOSITION MODEL [J].

FAMILY, F ;

VICSEK, T .

JOURNAL OF PHYSICS A-MATHEMATICAL AND GENERAL, 1985, 18 (02) :L75-L81

[5] Tapping mode atomic force microscopy analysis of the growth process of electroless nickel-phosphorus films an nonconducting surfaces [J].

Homma, T ;

Tanabe, M ;

Itakura, K ;

Osaka, T .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (12) :4123-4127

[6] Plating technology for electronics packaging [J].

Honma, H .

ELECTROCHIMICA ACTA, 2001, 47 (1-2) :75-84

[7] Anomalous scaling of the surface width during Cu electrodeposition [J].

Huo, S ;

Schwarzacher, W .

PHYSICAL REVIEW LETTERS, 2001, 86 (02) :256-259

[8] STABLE GROWTH AND KINETIC ROUGHENING IN ELECTROCHEMICAL DEPOSITION [J].

IWAMOTO, A ;

YOSHINOBU, T ;

IWASAKI, H .

PHYSICAL REVIEW LETTERS, 1994, 72 (25) :4025-4028

[9] Anomalous scaling of fracture surfaces [J].

Lopez, JM ;

Schmittbuhl, J .

PHYSICAL REVIEW E, 1998, 57 (06) :6405-6408

[10] Dynamic scaling exponents of copper electrodeposits from scanning force microscopy imaging. Influence of a thiourea additive on the kinetics of roughening and brightening [J].

Mendez, S ;

Andreasen, G ;

Schilardi, P ;

Figueroa, M ;

Vazquez, L ;

Salvarezza, RC ;

Arvia, AJ .

LANGMUIR, 1998, 14 (09) :2515-2524