Plating technology for electronics packaging

With the miniaturization of electronic devices, the connection reliability between integrated circuits (IC) and the external circuits has become important. Electroplating and electroless plating have been applied for the metallization of electronic components, Recently, advanced plating technology is strongly in demanded for the manufacturing of electronic components, because many devices are becoming finer and more complicated. In this paper, we focus mainly on the plating technologies for the preparation of micro-electronic components. The bump formation by electro and electroless plating, via-filling by copper electroplating, improvement of adhesion strength between the insulation laver and the deposited metal, and the preparation of anisotropic conductive particles have been investigated. (C) 2001 Elsevier Science Ltd. All rights reserved.