Applications of layer-by-layer polymer stereolithography for three-dimensional high-frequency components

被引:79
作者
Liu, B
Gong, X
Chappell, WJ
机构
[1] Univ Michigan, Dept Elect Engn, Ann Arbor, MI 48109 USA
[2] Purdue Univ, Elect & Comp Engn Dept, W Lafayette, IN 47907 USA
关键词
cavity resonators; embedded packaging; fabrication tolerance; layer-by-layer three-dimensional (3-D) fabrication; metal loss; narrow bandpass filter; stereolithography;
D O I
10.1109/TMTT.2004.837165
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A laser-based layer-by-layer additive process, stereolithography, is used to create truly three-dimensional (3-D) structures for high-frequency applications. High aspect-ratio complicated 3-D structures embedded inside of a layer-by-layer package are created by this process. Previously, Q's greater than 3000 and tolerances of similar to0.19% have been achieved for embedded resonators. In this paper, more applications are demonstrated. Particular examples include the integration of a nonplanar monopole antenna coupled to a high-Q embedded cavity with only 0.26% shift in resonant frequency (19.37 GHz) and a slight 0.06% reduction in bandwidth compared to simulation. Stacked cavities and coupling sections within a substrate are also demonstrated to create vertically integrated filters. For 2% bandwidth two-pole filters, insertion losses as small as 0.27 dB ate measured. Furthermore, a vertically integrated 1.2% four-pole filter is demonstrated with acceptable performance without tuning after fabrication. These applications illustrate that the laser-based stereolithography process is suitable for the integration of high-frequency and high-Q 3-D structures within a package.
引用
收藏
页码:2567 / 2575
页数:9
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