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Applications of layer-by-layer polymer stereolithography for three-dimensional high-frequency components
被引:79
作者:
Liu, B
Gong, X
Chappell, WJ
机构:
[1] Univ Michigan, Dept Elect Engn, Ann Arbor, MI 48109 USA
[2] Purdue Univ, Elect & Comp Engn Dept, W Lafayette, IN 47907 USA
关键词:
cavity resonators;
embedded packaging;
fabrication tolerance;
layer-by-layer three-dimensional (3-D) fabrication;
metal loss;
narrow bandpass filter;
stereolithography;
D O I:
10.1109/TMTT.2004.837165
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
A laser-based layer-by-layer additive process, stereolithography, is used to create truly three-dimensional (3-D) structures for high-frequency applications. High aspect-ratio complicated 3-D structures embedded inside of a layer-by-layer package are created by this process. Previously, Q's greater than 3000 and tolerances of similar to0.19% have been achieved for embedded resonators. In this paper, more applications are demonstrated. Particular examples include the integration of a nonplanar monopole antenna coupled to a high-Q embedded cavity with only 0.26% shift in resonant frequency (19.37 GHz) and a slight 0.06% reduction in bandwidth compared to simulation. Stacked cavities and coupling sections within a substrate are also demonstrated to create vertically integrated filters. For 2% bandwidth two-pole filters, insertion losses as small as 0.27 dB ate measured. Furthermore, a vertically integrated 1.2% four-pole filter is demonstrated with acceptable performance without tuning after fabrication. These applications illustrate that the laser-based stereolithography process is suitable for the integration of high-frequency and high-Q 3-D structures within a package.
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页码:2567 / 2575
页数:9
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