Design of a temperature-stable RF MEM capacitor

被引:33
作者
Nieminen, H [1 ]
Ermolov, V [1 ]
Silanto, S [1 ]
Nybergh, K [1 ]
Ryhänen, T [1 ]
机构
[1] Nokia Res Ctr, FIN-00045 Helsinki, Finland
关键词
microelectromechanical (MEM); RF MEMS; temperature compensation;
D O I
10.1109/JMEMS.2004.832192
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a novel temperature-compensated two-state microelectromechanical (MEM) capacitor. The principle to minimize temperature dependence is based on geometrical compensation and can be extended to other devices such as MEM varactors. The compensation structure eliminates the effect of intrinsic and thermal stress on device operation. This leads to a temperature-stable device without compromising the quality factor (Q) or the voltage behavior. The compensation structure increases the robustness of the devices, but does not require any modifications to the process. Measurement results verify that the OFF and ON capacitance change is less than 6% and the pull-in voltage is less than 5% when the temperature is varied from -30 to +70 degreesC.
引用
收藏
页码:705 / 714
页数:10
相关论文
共 17 条
[1]  
[Anonymous], 2003, RF MEMS THEORY TECHN
[2]   Microwave MEMS-based voltage-controlled oscillators [J].
Dec, Aleksander ;
Suyama, Ken .
IEEE Transactions on Microwave Theory and Techniques, 2000, 48 (11 I) :1943-1949
[3]   Intermodulation distortion and power handling in RF MEMS switches, varactors, and tunable filters [J].
Dussopt, L ;
Rebeiz, GM .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (04) :1247-1256
[4]   MEMS switchable interdigital coplanar filter [J].
Fourn, E ;
Pothier, A ;
Champeaux, C ;
Tristant, P ;
Catherinot, A ;
Blondy, P ;
Tanné, G ;
Rius, E ;
Person, C ;
Huret, F .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (01) :320-324
[5]  
Goldsmith C, 2001, IEEE MTT-S, P227, DOI 10.1109/MWSYM.2001.966876
[6]  
Goldsmith CL, 1999, INT J RF MICROW C E, V9, P362, DOI 10.1002/(SICI)1099-047X(199907)9:4<362::AID-MMCE7>3.0.CO
[7]  
2-H
[8]  
HONGTEUK K, 1999, IEEE MTT S INT MICR, V3, P1235
[9]   DC to 40 QHz on-wafer, package for RF MEMS switches [J].
Margomenos, A ;
Katehi, LPB .
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2002, :91-94
[10]   Microelectromechanical capacitors for RF applications [J].
Nieminen, H ;
Ermolov, V ;
Nybergh, K ;
Silanto, S ;
Ryhänen, T .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2002, 12 (02) :177-186