Physical metallurgy in lead-free electronic solder development

被引：16

作者：

Subramanian, KN ^{[1
]}

Lee, JG ^{[1
]}

机构：

[1] Michigan State Univ, Dept Chem Engn & Mat Sci, E Lansing, MI 48824 USA

来源：

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY | 2003年 / 55卷 / 05期

关键词：

D O I：

10.1007/s11837-003-0242-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Classical physical metallurgy principles play significant roles in the pursuit of suitable substitutes for traditional lead-based solders in the electronic industry. Phase diagrams, alloy development, solidification, diffusion, wetting, aging, precipitation of second-phase particles, microstructural coarsening, temperature effects, thermomechanical behavior, and creep are among the issues to be considered. This article focuses on the importance of physical metallurgy in these developments.

引用

页码：26 / 32

页数：7

共 52 条

[1]

[Anonymous], SOLDERING SURFACE MO

[2] Electromigration effect upon the Sn-0.7 wt% Cu/Ni and Sn-3.5 wt% Ag/Ni interfacial reactions [J].

Chen, CM ;

Chen, SW .

JOURNAL OF APPLIED PHYSICS, 2001, 90 (03) :1208-1214

[3] Damage accumulation under repeated reverse stressing of Sn-Ag solder joints [J].

Chen, KC ;

Telang, A ;

Lee, JG ;

Subramanian, KN .

JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) :1181-1189

[4] Creep properties of Sn-Ag solder joints containing intermetallic particles [J].

Choi, S ;

Lee, JG ;

Guo, F ;

Bieler, TR ;

Subramanian, KN ;

Lucas, JP .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2001, 53 (06) :22-26

[5] Microstructural characterization of damage in thermomechanically fatigued Sn-Ag based solder joints [J].

Choi, S ;

Lee, JG ;

Subramanian, KN ;

Lucas, JP ;

Bieler, TR .

JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (04) :292-297

[6] Formation and growth of interfacial intermetallic layers in eutectic Sn-Ag solder and its composite solder joints [J].

Choi, S ;

Lucas, JP ;

Subramanian, KN ;

Bieler, TR .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2000, 11 (06) :497-502

[7] Thermomechanical fatigue behavior of Sn-Ag solder joints [J].

Choi, S ;

Subramanian, KN ;

Lucas, JP ;

Bieler, TR .

JOURNAL OF ELECTRONIC MATERIALS, 2000, 29 (10) :1249-1257

[8] Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging [J].

Choi, S ;

Bieler, TR ;

Lucas, JP ;

Subramanian, KN .

JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) :1209-1215

[9]

CLATTERBAUGH GV, 1985, P 35 ECTC NEW YORK I

[10]

*EPA, 1991, EPA450491003

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