EUV engineering test stand

被引：43

作者：

Tichenor, DA ^{[1
]}

Kubiak, GD ^{[1
]}

Replogle, WC ^{[1
]}

Klebanoff, LE ^{[1
]}

Wronosky, JB ^{[1
]}

Hale, LC ^{[1
]}

Chapman, HN ^{[1
]}

Taylor, JS ^{[1
]}

Folta, JA ^{[1
]}

Montcalm, C ^{[1
]}

Hudyma, RM ^{[1
]}

Goldberg, KA ^{[1
]}

Naulleau, P ^{[1
]}

机构：

[1] Sandia Natl Labs, Livermore, CA 94551 USA

来源：

EMERGING LITHOGRAPHIC TECHNOLOGIES IV | 2000年 / 3997卷

关键词：

EUVL; lithography; multilayers coatings; optical fabrication; optical design; laser-produced plasma; laser plasma source; maglev; magnetic levitation; stages; precision engineering;

D O I：

10.1117/12.390083

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The Engineering Test Stand (ETS) is an EUV laboratory lithography tool. The purpose of the ETS is to demonstrate EUV full-field imaging and provide data required to support production-tool development. The ETS is configured to separate the imaging system and stages from the illumination system. Environmental conditions can be controlled independently in the two modules to maximize EUV throughput and environmental control. A source of 13.4 nm radiation is provided by a laser plasma source in which a YAG laser beam is focused onto a xenon-cluster target. A condenser system, comprised of multilayer-coated mirrors and grazing-incidence mirrors, collects the EUV radiation and directs it onto a reflecting reticle. A four-mirror, ring-field optical system, having a numerical aperture of 0.1, projects a 4x-reduction image onto the wafer plane. This design corresponds to a resolution of 70nm at a k(1) of 0.52. The ETS is designed to produce full-field images in step-and-scan mode using vacuum-compatible, one-dimension-long-travel magnetically levitated stages for both reticle and wafer. Reticle protection is incorporated into the ETS design. This paper provides a system overview of the ETS design and specifications.

引用

页码：48 / 69

页数：22

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