Microstructure of thermal hillocks on blanket Al thin films

被引:77
作者
Kim, D [1 ]
Heiland, B
Nix, WD
Arzt, E
Deal, MD
Plummer, JD
机构
[1] Stanford Univ, Ctr Integrated Syst, Stanford, CA 94305 USA
[2] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
[3] Max Planck Inst Met Forsch, Stuttgart, Germany
关键词
aluminum; hillock formation; microstructure; focused ion beam; creep deformation; stress relaxation;
D O I
10.1016/S0040-6090(00)00971-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The microstructure of thermal hillocks on blanket Al thin films has been studied for the first time by several techniques, including sectioning and imaging in a focused ion beam system. It is found that the new material in the hillock area lifts the original film up and in some cases penetrates it. The micrographs also reveal the grain structures and give valuable insight into the mechanisms of hillock growth. (C) 2000 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:278 / 282
页数:5
相关论文
共 9 条
[1]   A STUDY OF HEATING RATE AND TEXTURE INFLUENCES ON ANNEALING HILLOCKS BY A STATISTICAL CHARACTERIZATION OF AL THIN-FILM TOPOGRAPHY [J].
BACCONNIER, B ;
LORMAND, G ;
PAPAPIETRO, M ;
ACHARD, M ;
PAPON, AM .
JOURNAL OF APPLIED PHYSICS, 1988, 64 (11) :6483-6489
[2]   THE PREPARATION OF CROSS-SECTION SPECIMENS FOR TRANSMISSION ELECTRON-MICROSCOPY [J].
BRAVMAN, JC ;
SINCLAIR, R .
JOURNAL OF ELECTRON MICROSCOPY TECHNIQUE, 1984, 1 (01) :53-61
[3]   THE EFFECT OF SURFACE ALUMINUM-OXIDE FILMS ON THERMALLY-INDUCED HILLOCK FORMATION [J].
CHANG, CY ;
VOOK, RW .
THIN SOLID FILMS, 1993, 228 (1-2) :205-209
[4]   HILLOCK GROWTH IN THIN-FILMS [J].
CHAUDHAR.P .
JOURNAL OF APPLIED PHYSICS, 1974, 45 (10) :4339-4346
[5]  
GERTH D, 1992, MATER SCI FORUM, V94, P557, DOI 10.4028/www.scientific.net/MSF.94-96.557
[6]   A study of hillock formation on Al-Ta alloy films for interconnections of TFT-LCDs [J].
Iwamura, E ;
Ohnishi, T ;
Yoshikawa, K .
THIN SOLID FILMS, 1995, 270 (1-2) :450-455
[7]  
KIM DK, IN PRESS J MAT RES
[8]   MECHANICAL-PROPERTIES OF THIN-FILMS [J].
NIX, WD .
METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1989, 20 (11) :2217-2245
[9]   THE EFFECT OF LASER REFLOW ON THE VARIATION OF STRESS WITH THERMAL CYCLING IN ALUMINUM THIN-FILMS [J].
VENKATRAMAN, R ;
CHEN, S ;
BRAVMAN, JC .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1991, 9 (04) :2536-2542