共 18 条
[1]
MARTIN T, 1991, MANUFACTURING PROCES, V131, P43
[2]
Warpage studies of HDI test vehicles during various thermal profiling
[J].
IEEE TRANSACTIONS ON ADVANCED PACKAGING,
1999, 22 (04)
:624-637
[3]
Application of thermoelastic lamination theory to predict warpage of a symmetric and simply supported printed wiring board during temperature cycling
[J].
48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS,
1998,
:345-352
[4]
POLSKY Y, IN PRESS IEEE T ELEC
[5]
POST D, 1994, HIH SENSITIVITY MOIR
[6]
Use of compliant adhesives in the large area processing of MCM-D substrates
[J].
48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS,
1998,
:895-899
[7]
SOUTHERLIN S, 1998, P 48 IEEE EL COMP TE, P807
[9]
In-process board warpage measurement in a lab scale wave soldering oven
[J].
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A,
1996, 19 (04)
:562-569
[10]
TUMMALA R, 1997, SEMICONDUCTOR PACKAG