Process induced warpage in multitiled alumina substrates for large area MCM-D processing

被引:1
作者
Dang, AXH [1 ]
Ume, IC
Bhattacharya, SK
机构
[1] Georgia Inst Technol, George W Woodruff Sch Mech Engn, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, Packaging Res Ctr, Atlanta, GA 30332 USA
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2000年 / 23卷 / 03期
关键词
alumina; Clearfloat; large area substrate; MCM-D; pallet assembly; palletization; shadow moire; tile; warpage;
D O I
10.1109/6040.861558
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Electronics industries are responding to consumer demands in low-cost and high performance products for the 21st century. In order to find a low-cost solution for the future multichip module (MCM) packaging, a multitiling approach through the incorporation of several tiles on a large carrier substrate has been established in this study. The multitiling format provides simultaneous processing of several small (95-mm x 135-mm) alumina tiles onto a carrier glass pallet with comparable coefficient of thermal expansion (CTE), The objective of this study is to develop materials and processes for a 300-mm x 300-mm format that is scalable up to a 600 mm x 600 mm substrate. The fabrication process begins with a carrier substrate on which tiles are attached using a low modulus adhesive. This composite structure is exposed to high temperature thin film process that is required for the MCM-deposited (MCM-D) processing. The tiles are detached from the carrier substrate at an elevated temperature (similar to 450 degrees C). The warpage of these structures is a critical factor that determines the processability of the thin films in a manufacturing environment. This paper discusses the warpage issues associated with various stages of processing of the proposed large area MCM-D structures.
引用
收藏
页码:436 / 446
页数:11
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