ITO-Ag alloy-ITO film with stable and high conductivity depending on the control of atomically flat interface

被引：22

作者：

Chen, Shi-Wei ^{[1
]}

Koo, Chun-Hao ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 106, Taiwan

来源：

MATERIALS LETTERS | 2007年 / 61卷 / 19-20期

关键词：

surface morphology; Ag-Ti alloy; Ag-Ti-Cu alloy; resistivity;

D O I：

10.1016/j.matlet.2007.01.064

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The conductivity of ITO-Ag-ITO films declines with the deposition temperature increased above 200 degrees C, because the surfaces of Ag layers become rough that scatter the conduction carriers. The solid-solution Ag-Ti alloy and Ag-Ti-Cu alloy are developed to improve the stability of the surface morphology of Ag layers. This research proves that the Ag-Ti film can keep a smooth surface at an even higher deposition temperature. This leads ITO-AgTi-ITO films to have low resistivity at high deposition temperatures. However, further addition of Cu atoms into Ag-Ti films causes several spikes formed on the surfaces probably relative to the relaxation of strain energy. The conductivity of the ITO-AgTiCu-ITO film will decline when a large amount of spikes is formed on the surface of Ag-Ti-Cu layer at a high deposition temperature. (c) 2007 Elsevier B.V. All rights reserved.

引用

页码：4097 / 4099

页数：3

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