Development of polyimide flexible tactile sensor skin

被引:231
作者
Engel, J [1 ]
Chen, J [1 ]
Liu, C [1 ]
机构
[1] Univ Illinois, Micro Actuators Sensors & Syst Grp, Micro & Nanotechnol Lab, Urbana, IL 61801 USA
关键词
D O I
10.1088/0960-1317/13/3/302
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We present the development of a polyimide-based two-dimensional tactile sensing array realized using a novel inverted fabrication technique. Thermal silicon oxide or Pyrex(R) substrates are treated such that their surfaces are OH group terminated, allowing good adhesion between such substrates and a spun-on polyimide film during processing through what are suspected to be hydrogen bonds that can be selectively broken when release is desired. The release of the continuous polyimide film is rapidly accomplished by breaking these bonds. This process results in robust, low-cost and continuous polymer-film devices. The developed sensor skin contains an array of membrane-based tactile sensors (taxels). Micromachined thin-film metal strain gauges are positioned on the edges of polyimide membranes. The change in resistance from each strain gauge resulting from normal forces applied to tactile bumps on the top of the membranes is used to image force distribution. Response of an individual taxel is characterized. The effective gauge factor of the taxels is found to be approximately 1.3. Sensor array output is experimentally obtained. The demonstrated devices are robust enough for direct contact with humans, everyday objects and contaminants without undue care.
引用
收藏
页码:359 / 366
页数:8
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