GaN MESFETs on (111) Si substrate grown by MOCVD

被引:34
作者
Egawa, T
Nakada, N
Ishikawa, H
Umeno, M
机构
[1] Nagoya Inst Technol, Res Ctr Microstruct Devices, Showa Ku, Nagoya, Aichi 4668555, Japan
[2] Nagoya Inst Technol, Dept Elect & Comp Engn, Showa Ku, Nagoya, Aichi 4668555, Japan
关键词
D O I
10.1049/el:20001282
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A GaN metal-semiconductor field-effect transistor (MESFET) has been gown on (111) Si substrate by metalorganic chemical vapour deposition using Al0.27Ga0.73N/AlN intermediate layers. The device showed a maximum extrinsic transconductance 25mS/mm and a drain-source current 169mA/mm with a complete pinch-off for the 2.5 mum gate-length. The Al0.27Ga0.73N/AlN intermediate layers were effective in obtaining a mirror-like surface morphology and a high-resistive undoped GaN layer beneath a channel layer. The GaN MESFET on Si also exhibited no self-heating effects (drain-source current reduction) under high-power conditions, which results from the better thermal properties of Si than those of sapphire.
引用
收藏
页码:1816 / 1818
页数:3
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