Zinc diffusion process investigation of InP-based test structures for high-speed avalanche photodiode fabrication

被引:26
作者
Yun, I [1 ]
Hyun, KS
机构
[1] Yonsei Univ, Sch Elect & Mech Engn, Elect Engn Div, Seoul 120749, South Korea
[2] Telecom, Basic Res Lab, Elect & Telecommun Res Inst, Yusung Ku, Taejon 305350, South Korea
关键词
zinc diffusion; III-V compound semiconductor; avalanche photodiode; semiconductor manufacturing;
D O I
10.1016/S0026-2692(00)00066-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The characterization of zinc diffusion processes for three different test structures has been investigated. The comparison between the different diffusion process conditions for different test structures were explored. The zinc diffusion profiles, such as the diffusion depth and the zinc dopant concentration, were examined using secondary ion mass spectrometry with varying the amount of Zn3P2 source, the ampoule volume, and the diffusion time. It is observed that the diffusion profiles are severely impacted on the process parameters, such as the amount of Zn3P2 source, the ampoule volume, and the diffusion time, as well as material parameters, such as doping concentration of the diffusion layer. These results from the Zn diffusion process can be utilized for the high-speed InP/InGaAs avalanche photodiodes fabrication. (C) 2000 Elsevier Science Ltd. All rights reserved.
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页码:635 / 639
页数:5
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