Removal of NF3 from semiconductor-process flue gases by tandem packed-bed plasma and adsorbent hybrid systems

被引：78

作者：

Chang, JS ^{[1
]}

Kostov, KG

Urashima, K

Yamamoto, T

Okayasu, Y

Kato, T

Iwaizumi, T

Yoshimura, K

机构：

[1] McMaster Univ, Dept Engn Phys, Hamilton, ON L8S 4M1, Canada

[2] Univ Osaka Prefecture, Dept Energy Syst Engn, Osaka 599, Japan

[3] EBARA Co, Tokyo 1088480, Japan

来源：

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS | 2000年 / 36卷 / 05期

关键词：

adsorbent; CaCO3; cleaning process; flue gas; NF3; packed bed; plasma; semiconductor;

D O I：

10.1109/28.871272

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A tandem hybrid gas cleanup system, consisting of a BaTiO3 packed-bed plasma reactor and a CaCO3 adsorbent filter, was used to study the removal of NF3 from semiconductor-process flue gases. Plasma-chemical kinetics of N-2-NF3-O-2-H-2 gas mixtures suggested byproducts observed in the experiments. The laboratory-scale system showed NF3 removal at atmospheric pressure. Typically, 100% NF3 abatement was achieved with an inlet concentration of 5000 ppm and a gas residence time in the reactor less than 10 s.

引用

页码：1251 / 1259

页数：9

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