Fast atom beam etching of glass materials with contact and non-contact masks

被引:33
作者
Toma, Y [1 ]
Hatakeyama, M [1 ]
Ichiki, K [1 ]
Huang, HL [1 ]
Yamauchi, K [1 ]
Watanabe, K [1 ]
Kato, T [1 ]
机构
[1] Ebara Res Co Ltd, Kanagawa 251, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1997年 / 36卷 / 12B期
关键词
fast atom beam; FAB; silica glass; multicomponent glass; etching; contact mask; non-contact mask; nano-scale ultrafine etching; micro-particle mask;
D O I
10.1143/JJAP.36.7655
中图分类号
O59 [应用物理学];
学科分类号
摘要
Fast atom beam (FAB) etching of multicomponent glass and silica glass was performed using a contact mask (electron beam resist) and two non-contact masks (typically 5-mu m-diameter particles and a copper mesh with a 5 mu m Line width and 20 mu m line spacing). FAB etching of a multi component glass substrate with the micro-particle mask successfully fabricated a precisely projected, 1.0-mu m-high outline pattern on the substrate. FAB etching of a silica glass substrate with the copper-mesh mask, which was separated from the substrate by about 100 mu m, successfully produced a projected, 34-nm-high outline pattern on the substrate. A combination of electron beam lithography with FAB etching on silica glass successfully fabricated nano-scale ultrafine patterns whose aspect ratio was higher than 7 (50 nm Line width and 360 nm height). In all three fabrications, the side walls and etched surfaces were very smooth and were perpendicular to each other.
引用
收藏
页码:7655 / 7659
页数:5
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