Optical interconnects at the chip and board level: Challenges and solutions

被引：74

作者：

Plant, DV ^{[1
]}

Kirk, AG ^{[1
]}

机构：

[1] McGill Univ, Dept Elect & Comp Engn, Montreal, PQ H3A 2A7, Canada

来源：

PROCEEDINGS OF THE IEEE | 2000年 / 88卷 / 06期

基金：

加拿大自然科学与工程研究理事会;

关键词：

microoptics; optical data links; optical interconnects; optical packaging; optoelectronics;

D O I：

10.1109/5.867694

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper discusses short-distance optical interconnects for general-purpose distributed digital systems. We describe the technology required to optically interconnect elements that are distributed across multiple packaging layers. This includes chips on a board, boards in a backplane, and shelves within a bay. The focus of this paper will be on technology capable of supporting high-data-rate, two-dimensional, optical communication using two-dimensional parallel optical interconnects.

引用

页码：806 / 818

页数：13

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