SOP integration and codesign of antennas

被引：30

作者：

Brebels, S ^{[1
]}

Ryckaert, J ^{[1
]}

Côme, B ^{[1
]}

Donnay, S ^{[1
]}

De Raedt, W ^{[1
]}

Beyne, E ^{[1
]}

Mertens, RP ^{[1
]}

机构：

[1] IMEC, MCP, EDAS, B-3001 Louvain, Belgium

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2004年 / 27卷 / 02期

关键词：

antennas; codesign; integration; system-on-package (SOP);

D O I：

10.1109/TADVP.2004.828822

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The successful deployment of wireless systems requires the integration of small, cost-effective antennas while preserving a reasonable electrical performance in the required bandwidth. This paper begins with a short overview of the most important antenna characteristics, and then uses these to describe the minimum requirements and fundamental performance-size limits for electrically small integrated antennas. The performance-size tradeoff is further illustrated by the design of a planar integrated antenna for WLAN. Codesign guidelines are given to avoid parasitic coupling between the integrated antenna and RF circuits. A concluding comparison is made between on-chip and on-package integration of a small antenna for microwave and millimeter wave systems.

引用

页码：341 / 351

页数：11

共 43 条

[1]

[Anonymous], 1953, 3 USAF S ANT

[2] Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits [J].