MICROSTRUCTURE EVOLUTION IN TIN FILMS REACTIVELY SPUTTER DEPOSITED ON MULTIPHASE SUBSTRATES

被引：72

作者：

HELMERSSON, U

SUNDGREN, JE

GREENE, JE

机构：

[1] UNIV ILLINOIS,DEPT MET,URBANA,IL 61801

[2] UNIV ILLINOIS,COORDINATED SCI LAB,URBANA,IL 61801

[3] UNIV ILLINOIS,MAT RES LAB,URBANA,IL 61801

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1986年 / 4卷 / 03期

关键词：

D O I：

10.1116/1.573868

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：500 / 503

页数：4

共 20 条

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[6] ADHESION OF TITANIUM NITRIDE COATINGS ON HIGH-SPEED STEELS
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[7] EFFECTS OF SUBSTRATE-TEMPERATURE AND SUBSTRATE MATERIAL ON THE STRUCTURE OF REACTIVELY SPUTTERED TIN FILMS
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SUNDGREN, JE
HELMERSSON, U
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[8] THE EFFECT OF OXYGEN ON THE GRAIN-BOUNDARY AND VOID STRUCTURE OF TITANIUM FILMS
HIBBS, MK
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[J]. THIN SOLID FILMS, 1984, 116 (1-3) : 177 - 189
[9] INITIAL GROWTH OF TIN ON DIFFERENT PHASES OF HIGH-SPEED STEEL
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SUNDGREN, JE
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HELMERSSON, U
[J]. THIN SOLID FILMS, 1985, 124 (02) : 163 - 170
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