FAILURE TEMPERATURE OF AMORPHOUS CU-TA ALLOYS AS DIFFUSION-BARRIERS IN AL-SI CONTACTS

被引:19
作者
SARIS, FW [1 ]
HUNG, LS [1 ]
NASTASI, M [1 ]
MAYER, JW [1 ]
WHITEHEAD, B [1 ]
机构
[1] CORNELL UNIV,NATL RES & RESOURCE FACIL SUBMICRON STRUCT,ITHACA,NY 14853
关键词
D O I
10.1063/1.95515
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:646 / 648
页数:3
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