BARRIER LAYERS - PRINCIPLES AND APPLICATIONS IN MICROELECTRONICS

[1] INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN [J]. THIN SOLID FILMS, 1983, 107 (01) : 45 - 54

[2] Baglin J. E. E., 1978, Thin films. Interdiffusion and reactions, P305

[3] ALUMINUM CONTACT TO NICKEL SILICIDE USING A THIN TUNGSTEN BARRIER [J]. THIN SOLID FILMS, 1982, 91 (02) : 89 - 98

[4] ELECTRICAL CHARACTERISTICS OF AL CONTACT TO NISI USING THIN W LAYER AS A BARRIER [J]. APPLIED PHYSICS LETTERS, 1981, 39 (10) : 822 - 824

[5] BOWER RW, 1973, APPL PHYS LETT, V23, P99, DOI 10.1063/1.1654823

[6] Brenner S., 1983, 1983 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, P152

[7] INTER-DIFFUSION AND COMPOUND FORMATION IN THE C-SI/PTSI/(TI-W)/A1 SYSTEM [J]. THIN SOLID FILMS, 1982, 88 (01) : 9 - 23

[8] ELECTRICAL DEGRADATION OF N-SI/PTSI/(TI-W)/AL SCHOTTKY CONTACTS INDUCED BY THERMAL TREATMENTS [J]. THIN SOLID FILMS, 1982, 97 (04) : 325 - 331

[9] DIFFUSION OF COPPER IN THIN TIN FILMS [J]. THIN SOLID FILMS, 1982, 91 (02) : 155 - 162

[10] DIFFUSION IN A PD-CU-SI METALLIC GLASS [J]. APPLIED PHYSICS LETTERS, 1978, 32 (08) : 461 - 463

[1] INVESTIGATION OF TIN FILMS REACTIVELY SPUTTERED USING A SPUTTER GUN [J]. THIN SOLID FILMS, 1983, 107 (01) : 45 - 54

[2] Baglin J. E. E., 1978, Thin films. Interdiffusion and reactions, P305

[3] ALUMINUM CONTACT TO NICKEL SILICIDE USING A THIN TUNGSTEN BARRIER [J]. THIN SOLID FILMS, 1982, 91 (02) : 89 - 98

[4] ELECTRICAL CHARACTERISTICS OF AL CONTACT TO NISI USING THIN W LAYER AS A BARRIER [J]. APPLIED PHYSICS LETTERS, 1981, 39 (10) : 822 - 824

[5] BOWER RW, 1973, APPL PHYS LETT, V23, P99, DOI 10.1063/1.1654823

[6] Brenner S., 1983, 1983 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, P152

[7] INTER-DIFFUSION AND COMPOUND FORMATION IN THE C-SI/PTSI/(TI-W)/A1 SYSTEM [J]. THIN SOLID FILMS, 1982, 88 (01) : 9 - 23

[8] ELECTRICAL DEGRADATION OF N-SI/PTSI/(TI-W)/AL SCHOTTKY CONTACTS INDUCED BY THERMAL TREATMENTS [J]. THIN SOLID FILMS, 1982, 97 (04) : 325 - 331

[9] DIFFUSION OF COPPER IN THIN TIN FILMS [J]. THIN SOLID FILMS, 1982, 91 (02) : 155 - 162

[10] DIFFUSION IN A PD-CU-SI METALLIC GLASS [J]. APPLIED PHYSICS LETTERS, 1978, 32 (08) : 461 - 463