ADVANCED BIPOLAR-TRANSISTOR MODELING - PROCESS AND DEVICE SIMULATION TOOLS FOR TODAYS TECHNOLOGY

被引:18
作者
KNEPPER, RW [1 ]
GAUR, SP [1 ]
CHANG, FY [1 ]
SRINIVASAN, GR [1 ]
机构
[1] IBM CORP, E FISHKILL FACIL, DIV GEN TECHNOL, DEPT COMP AIDED DEVICE DESIGN, HOPEWELL JUNCTION, NY 12533 USA
关键词
D O I
10.1147/rd.293.0218
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
引用
收藏
页码:218 / 228
页数:11
相关论文
共 18 条
[1]  
ANTONIADIS DA, 1978, 50192 STANF U STANF
[2]   FINITE-ELEMENT ANALYSIS OF SEMICONDUCTOR-DEVICES - THE FIELDAY PROGRAM [J].
BUTURLA, EM ;
COTTRELL, PE ;
GROSSMAN, BM ;
SALSBURG, KA .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1981, 25 (04) :218-231
[3]  
BUTURLA EM, 1981, JUN P NASECODE 2 C D, P160
[4]   THE GENERATION OF 3-DIMENSIONAL BIPOLAR-TRANSISTOR MODELS FOR CIRCUIT ANALYSIS [J].
CHANG, FY ;
WAGNER, LF .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1985, 29 (03) :252-262
[5]  
CHANG FY, 1982, 1ST P INT S VER LARG, V82, P275
[7]   TWO-DIMENSIONAL DEVICE SIMULATION PROGRAM - 2DP [J].
GAUR, SP ;
HABITZ, PA ;
PARK, YJ ;
COOK, RK ;
HUANG, YS ;
WAGNER, LF .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1985, 29 (03) :242-251
[8]  
GETREU IE, 1978, MODELING BIPOLAR TRA
[9]   SEMICONDUCTOR ANALYSIS USING FINITE-ELEMENTS .1. COMPUTATIONAL ASPECTS [J].
HACHTEL, GD ;
MACK, MH ;
OBRIEN, RR ;
SPEELPENNING, B .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1981, 25 (04) :232-245
[10]  
NAKAMURA T, 1984, ISSCC DIG TECH PAP I, V27, P152