GENERAL EXPRESSIONS FOR THE TCR OF THIN METALLIC-FILMS AND WIRES

被引：11

作者：

JAIN, N

SRIVASTAVA, R

机构：

来源：

JOURNAL OF MATERIALS SCIENCE LETTERS | 1982年 / 1卷 / 09期

关键词：

D O I：

10.1007/BF00724850

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：397 / 399

页数：3

共 10 条

[1]

CAMPBELL DS, 1966, USE THIN FILMS PHYSI, P299

[2] ELECTRICAL-CONDUCTIVITY OF VERY THIN METAL-FILMS [J].

GOTTLIEB, D ;

HALPERN, V .

JOURNAL OF PHYSICS F-METAL PHYSICS, 1976, 6 (12) :2333-2339

[3]

KITTEL C, 1979, INTRO SOLID STATE PH

[4]

Larson D.C., 1971, PHYS THIN FILMS, V6, P81

[5] THERMAL STRAINS IN THIN METALLIC-FILMS [J].

PICHARD, CR ;

TELLIER, CR ;

TOSSER, AJ .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1980, 13 (07) :1325-1329

[6]

SELLO IBH, 1970, HDB THIN FILM TECHNO, P23

[7] EFFECT OF THERMAL-EXPANSION OF THE GRAIN-BOUNDARY REFLECTION COEFFICIENT ON THE TEMPERATURE-COEFFICIENT OF RESISTIVITY OF THIN POLYCRYSTALLINE FILMS [J].

TELLIER, CR ;

TOSSER, AJ .

THIN SOLID FILMS, 1979, 60 (01) :91-95

[8] SIZE EFFECT AND TEMPERATURE-COEFFICIENT OF RESISTANCE IN THIN-FILMS [J].

WARKUSZ, F .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1978, 11 (05) :689-694

[9] SIZE EFFECT AND TEMPERATURE-COEFFICIENT OF TOTAL RESISTANCE IN THIN METAL-FILMS [J].

WARKUSZ, F .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1978, 11 (14) :2035-2041

[10]

Warkusz F., 1979, Materials Science, V5, P69

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