THERMAL STRAINS IN THIN METALLIC-FILMS

被引：12

作者：

PICHARD, CR

TELLIER, CR

TOSSER, AJ

机构：

来源：

JOURNAL OF PHYSICS D-APPLIED PHYSICS | 1980年 / 13卷 / 07期

关键词：

D O I：

10.1088/0022-3727/13/7/028

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：1325 / 1329

页数：5

共 14 条

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[2]

HOFFMANN RW, 1966, PHYS THIN FILMS, V3, P210

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PIROZZI, L ;

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TARONI, A .

JOURNAL OF PHYSICS D-APPLIED PHYSICS, 1979, 12 (05) :L51-L54

[4] SIZE EFFECT ON ELECTRICAL CONDUCTIVITY AND LONGITUDINAL GAUGE FACTOR OF THIN METAL FILMS [J].

REALE, C .

CZECHOSLOVAK JOURNAL OF PHYSICS SECTION B, 1971, B 21 (06) :662-&

[5]

SINGH A, 1972, THIN FILMS, V2, P159

[6] POISSONS RATIO DEPENDENCE OF TEMPERATURE COEFFICIENT OF RESISTANCE OF SILVER FILMS ON MICA [J].

SINGH, A .

THIN SOLID FILMS, 1973, 15 (03) :S33-S35

[7] TEMPERATURE-COEFFICIENT OF RESISTIVITY OF POLYCRYSTALLINE RADIO-FREQUENCY SPUTTERED ALUMINUM FILMS [J].

TELLIER, CR ;

TOSSER, AJ .

THIN SOLID FILMS, 1977, 43 (03) :261-266

[8] GRAIN-SIZE DEPENDENCE OF GAUGE FACTOR OF THIN METALLIC-FILMS [J].

TELLIER, CR ;

TOSSER, AJ .

ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1977, 4 (01) :9-17

[9] APPROXIMATE STRAIN COEFFICIENTS OF METALLIC-FILMS DEDUCED FROM AN EFFECTIVE FUCHS-SONDHEIMER CONDUCTION MODEL AND FROM AN EFFECTIVE RELAXATION-TIME METHOD [J].

TELLIER, CR ;

TOSSER, AJ .

THIN SOLID FILMS, 1979, 57 (01) :163-168

[10]

TELLIER CR, 1978, VIDE S, V189, P25

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