ANALYSIS OF THERMAL STRESS-INDUCED GRAIN-BOUNDARY CAVITATION AND NOTCHING IN NARROW AL-SI METALLIZATIONS

被引：49

作者：

LI, CY

BLACK, RD

LAFONTAINE, WR

机构：

来源：

关键词：

D O I：

10.1063/1.100113

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：31 / 33

页数：3

共 12 条

[1] CARSLAW HS, 1959, CONDUCTION HEAT SOLI, P388
[2] DIFFUSIVE GROWTH OF GRAIN-BOUNDARY CAVITIES
CHEN, IW
ARGON, AS
[J]. ACTA METALLURGICA, 1981, 29 (10): : 1759 - 1768
[3] Colgan E. G., 1987, Journal of Materials Research, V2, P557, DOI 10.1557/JMR.1987.0557
[4] FINE ME, 1964, PHASE TRANSFORMATION, P56
[5] MEASUREMENT AND INTERPRETATION OF STRESS IN ALUMINUM-BASED METALLIZATION AS A FUNCTION OF THERMAL HISTORY
FLINN, PA
GARDNER, DS
NIX, WD
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1987, 34 (03) : 689 - 699
[6] DIFFUSIONAL VISCOSITY OF A POLYCRYSTALLINE SOLID
HERRING, C
[J]. JOURNAL OF APPLIED PHYSICS, 1950, 21 (05) : 437 - 445
[7] STRESS-INDUCED GRAIN-BOUNDARY FRACTURES IN AL-SI INTERCONNECTS
HINODE, K
OWADA, N
NISHIDA, T
MUKAI, K
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1987, 5 (02): : 518 - 522
[8] HIRTH JP, 1969, THEORY DISLOCATIONS, P546
[9] THE GROWTH OF GRAIN-BOUNDARY VOIDS UNDER STRESS
HULL, D
RIMMER, DE
[J]. PHILOSOPHICAL MAGAZINE, 1959, 4 (42): : 673 - 687
[10] STRESS-RELAXATION AND HILLOCK GROWTH IN THIN-FILMS
JACKSON, MS
LI, CY
[J]. ACTA METALLURGICA, 1982, 30 (11): : 1993 - 2000